COMPOSITION FOR REMOVAL OF INSULATION MATERIAL, METHOD OF REMOVAL OF INSULATION FILM USING THE COMPOSITION, AND REPRODUCTION METHOD OF SUBSTRATE

COMPOSITION FOR REMOVAL OF INSULATION MATERIAL, METHOD OF REMOVAL OF INSULATION FILM USING THE COMPOSITION, AND REPRODUCTION METHOD OF SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for removing an insulation film without damaging boards, and to provide a method for economically reproducing the boards. SOLUTION: The composition to remove an insulation material comprises both or either one of a low dielectric-constant material and/or a p...

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Hauptverfasser: KIN EINAN, KIM HYUN-JOON, KYO TOBIN, TAKASHIMA MASAYUKI, SON HEIU, RI SHUNTOKU, MEI JUZAI, PARK BENKEI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator KIN EINAN
KIM HYUN-JOON
KYO TOBIN
TAKASHIMA MASAYUKI
SON HEIU
RI SHUNTOKU
MEI JUZAI
PARK BENKEI
description PROBLEM TO BE SOLVED: To provide a method for removing an insulation film without damaging boards, and to provide a method for economically reproducing the boards. SOLUTION: The composition to remove an insulation material comprises both or either one of a low dielectric-constant material and/or a protective material, wherein 1-50 mass% of an oxidizing agent, 0.1-35 mass% of a fluorine-containing compound, and water for the rest are contained in a total composition of 100 mass%. COPYRIGHT: (C)2007,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title COMPOSITION FOR REMOVAL OF INSULATION MATERIAL, METHOD OF REMOVAL OF INSULATION FILM USING THE COMPOSITION, AND REPRODUCTION METHOD OF SUBSTRATE
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