COMPOSITION FOR REMOVAL OF INSULATION MATERIAL, METHOD OF REMOVAL OF INSULATION FILM USING THE COMPOSITION, AND REPRODUCTION METHOD OF SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method for removing an insulation film without damaging boards, and to provide a method for economically reproducing the boards. SOLUTION: The composition to remove an insulation material comprises both or either one of a low dielectric-constant material and/or a p...

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Bibliographische Detailangaben
Hauptverfasser:	KIN EINAN, KIM HYUN-JOON, KYO TOBIN, TAKASHIMA MASAYUKI, SON HEIU, RI SHUNTOKU, MEI JUZAI, PARK BENKEI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for removing an insulation film without damaging boards, and to provide a method for economically reproducing the boards. SOLUTION: The composition to remove an insulation material comprises both or either one of a low dielectric-constant material and/or a protective material, wherein 1-50 mass% of an oxidizing agent, 0.1-35 mass% of a fluorine-containing compound, and water for the rest are contained in a total composition of 100 mass%. COPYRIGHT: (C)2007,JPO&INPIT