APPARATUS FOR ELECTROLESS DEPOSITION OF METAL ONTO SEMICONDUCTOR SUBSTRATE
PROBLEM TO BE SOLVED: To provide an integrated electroless deposition apparatus that can deposit a uniform layer with minimum defects. SOLUTION: An electroless deposition system and an electroless deposition station are provided. The system includes a processing mainframe, at least one substrate cle...
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| creator | LUBOMIRSKY DMITRY SHANMUGASUNDRAM ARULKUMAR PANCHAM IAN A |
| description | PROBLEM TO BE SOLVED: To provide an integrated electroless deposition apparatus that can deposit a uniform layer with minimum defects. SOLUTION: An electroless deposition system and an electroless deposition station are provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate the surface of the substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate shuttle positioned to transfer the substrate between the first and second processing stations. The electroless deposition station also includes various fluid delivery devices and substrate temperature controlling devices to perform a contamination-free and uniform electroless deposition process. COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
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SOLUTION: An electroless deposition system and an electroless deposition station are provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate the surface of the substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate shuttle positioned to transfer the substrate between the first and second processing stations. The electroless deposition station also includes various fluid delivery devices and substrate temperature controlling devices to perform a contamination-free and uniform electroless deposition process. 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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | APPARATUS FOR ELECTROLESS DEPOSITION OF METAL ONTO SEMICONDUCTOR SUBSTRATE |
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