APPARATUS FOR ELECTROLESS DEPOSITION OF METAL ONTO SEMICONDUCTOR SUBSTRATE

PROBLEM TO BE SOLVED: To provide an integrated electroless deposition apparatus that can deposit a uniform layer with minimum defects. SOLUTION: An electroless deposition system and an electroless deposition station are provided. The system includes a processing mainframe, at least one substrate cleaning station positioned on the mainframe, and an electroless deposition station positioned on the mainframe. The electroless deposition station includes an environmentally controlled processing enclosure, a first processing station configured to clean and activate the surface of the substrate, a second processing station configured to electrolessly deposit a layer onto the surface of the substrate, and a substrate shuttle positioned to transfer the substrate between the first and second processing stations. The electroless deposition station also includes various fluid delivery devices and substrate temperature controlling devices to perform a contamination-free and uniform electroless deposition process. COPYRIGHT: (C)2007,JPO&INPIT