SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device for ensuring enough heat radiation even if a semiconductor chip is miniaturized. SOLUTION: The semiconductor device includes an upper surface on which an anode electrode 21 is formed; a bottom surface facing the upper surface on which a cathode electrode 26 is formed as a counter electrode of an anode electrode 21; side surfaces formed between the upper surface and the bottom surface; a semiconductor chip 20 where a ratio of a distance (thickness) is 1/4 or more between the upper surface and the bottom surface to a short side of the bottom surface; an insulating substrate 15 in which a wiring metal plate 11 having a recess capable of accommodating the semiconductor chip 20, and having a bottomed wall surface is fixed to a principal surface side; a solder 51 disposed most far away from the bottom of the anode electrode 21 to accommodate the semiconductor chip 20 in the recess of the wiring metal plate 11 for connecting the cathode electrode 26 and the wiring metal plate 11; a heat conductive member 53 for connecting the side surface and the wiring metal plate 11; and a wire 41 electrically connected with the anode electrode 21. COPYRIGHT: (C)2007,JPO&INPIT