PLASMA TREATMENT APPARATUS

PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus which corrects the distortion of an equal potential plane around four sides of a lower electrode and can perform plasma treatment around the four sides of an object to be treated in nearly the same uniformity as that of the center. SOLUTI...

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Bibliographische Detailangaben
Hauptverfasser: OGATA HIDETAKE, OKADA YOSHIHIRO, IKUTAKE TAKUYA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus which corrects the distortion of an equal potential plane around four sides of a lower electrode and can perform plasma treatment around the four sides of an object to be treated in nearly the same uniformity as that of the center. SOLUTION: An electric field correcting dielectric 1 provided to the plasma treatment apparatus is provided with a frame plate 2 arranged on a lower electrode 18 as one electrode and a wall plate 3 thereon, in a reaction chamber wherein high-frequency electric power is applied among facing electrodes to generate the plasma of a processing gas. The electric field correcting dielectric 1 suppresses a change in electric field especially around/adjacent to a treated substrate 12 placed on the lower electrode 18 in the frame plate 2, and it forms a parallel equal potential plane at nearly the same degree as that on the central upper side of the lower electrode 18. Therefore, plasma treatment speed at the periphery of the processing substrate 12 can be prevented from being made nonuniform when compared with the central part of the treated substrate 12. COPYRIGHT: (C)2007,JPO&INPIT