METHOD OF MANUFACTURING THIN-FILM ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method of manufacturing a thin-film electronic component which can prevent deterioration in the performance of a thin-film electronic component. SOLUTION: In this method of manufacturing a thin-film electronic component, a dielectric layer 16 having first through holes 16a, 16b is formed on a base material 10, and a first conductive layer 31 for covering at least one part of the dielectric layer is formed. A second conductive layer 32 may be further provided on the top surface of the substrate 10, and the dielectric layer 16 may cover one part of the second conductive layer 32. After that, through holes 52, 53 piercing the base material, passing through the insides of the first through holes 16a, 16b and reaching the first and second conductive layers are formed. By allowing a conductive material to adhere on the inside surfaces of these through holes, vias 54, 55 conducting to the conductive layers 31, 32 can be formed. COPYRIGHT: (C)2007,JPO&INPIT