SURFACE-PROCESSING METHOD AND SURFACE-PROCESSING DEVICE

PROBLEM TO BE SOLVED: To provide a surface-processing method and a surface-processing device, capable of easily forming a rough surface on a substrate surface or thin film where the size and distribution are controlled in detail. SOLUTION: The surface processing method includes a process for sprayin...

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Hauptverfasser: TONO HIDESHI, YONEMOTO KIMIHIKO, SUGANO HITOSHI
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creator TONO HIDESHI
YONEMOTO KIMIHIKO
SUGANO HITOSHI
description PROBLEM TO BE SOLVED: To provide a surface-processing method and a surface-processing device, capable of easily forming a rough surface on a substrate surface or thin film where the size and distribution are controlled in detail. SOLUTION: The surface processing method includes a process for spraying fine particles on an object to be processed, and a process for plasma-processing the object with the fine particles as a mask. COPYRIGHT: (C)2007,JPO&INPIT
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2007027564A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2007027564A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2007027564A3</originalsourceid><addsrcrecordid>eNrjZDAPDg1yc3R21Q0I8nd2DQ729HNX8HUN8fB3UXD0c1HAIuviGubp7MrDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDMwNjMxNzUwcjYlSBACaayi-</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SURFACE-PROCESSING METHOD AND SURFACE-PROCESSING DEVICE</title><source>esp@cenet</source><creator>TONO HIDESHI ; YONEMOTO KIMIHIKO ; SUGANO HITOSHI</creator><creatorcontrib>TONO HIDESHI ; YONEMOTO KIMIHIKO ; SUGANO HITOSHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a surface-processing method and a surface-processing device, capable of easily forming a rough surface on a substrate surface or thin film where the size and distribution are controlled in detail. SOLUTION: The surface processing method includes a process for spraying fine particles on an object to be processed, and a process for plasma-processing the object with the fine particles as a mask. COPYRIGHT: (C)2007,JPO&amp;INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2007</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070201&amp;DB=EPODOC&amp;CC=JP&amp;NR=2007027564A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20070201&amp;DB=EPODOC&amp;CC=JP&amp;NR=2007027564A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TONO HIDESHI</creatorcontrib><creatorcontrib>YONEMOTO KIMIHIKO</creatorcontrib><creatorcontrib>SUGANO HITOSHI</creatorcontrib><title>SURFACE-PROCESSING METHOD AND SURFACE-PROCESSING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a surface-processing method and a surface-processing device, capable of easily forming a rough surface on a substrate surface or thin film where the size and distribution are controlled in detail. SOLUTION: The surface processing method includes a process for spraying fine particles on an object to be processed, and a process for plasma-processing the object with the fine particles as a mask. COPYRIGHT: (C)2007,JPO&amp;INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2007</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDAPDg1yc3R21Q0I8nd2DQ729HNX8HUN8fB3UXD0c1HAIuviGubp7MrDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDMwNjMxNzUwcjYlSBACaayi-</recordid><startdate>20070201</startdate><enddate>20070201</enddate><creator>TONO HIDESHI</creator><creator>YONEMOTO KIMIHIKO</creator><creator>SUGANO HITOSHI</creator><scope>EVB</scope></search><sort><creationdate>20070201</creationdate><title>SURFACE-PROCESSING METHOD AND SURFACE-PROCESSING DEVICE</title><author>TONO HIDESHI ; YONEMOTO KIMIHIKO ; SUGANO HITOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2007027564A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2007</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>TONO HIDESHI</creatorcontrib><creatorcontrib>YONEMOTO KIMIHIKO</creatorcontrib><creatorcontrib>SUGANO HITOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TONO HIDESHI</au><au>YONEMOTO KIMIHIKO</au><au>SUGANO HITOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SURFACE-PROCESSING METHOD AND SURFACE-PROCESSING DEVICE</title><date>2007-02-01</date><risdate>2007</risdate><abstract>PROBLEM TO BE SOLVED: To provide a surface-processing method and a surface-processing device, capable of easily forming a rough surface on a substrate surface or thin film where the size and distribution are controlled in detail. SOLUTION: The surface processing method includes a process for spraying fine particles on an object to be processed, and a process for plasma-processing the object with the fine particles as a mask. COPYRIGHT: (C)2007,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title SURFACE-PROCESSING METHOD AND SURFACE-PROCESSING DEVICE
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