SURFACE-PROCESSING METHOD AND SURFACE-PROCESSING DEVICE

PROBLEM TO BE SOLVED: To provide a surface-processing method and a surface-processing device, capable of easily forming a rough surface on a substrate surface or thin film where the size and distribution are controlled in detail. SOLUTION: The surface processing method includes a process for sprayin...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TONO HIDESHI, YONEMOTO KIMIHIKO, SUGANO HITOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a surface-processing method and a surface-processing device, capable of easily forming a rough surface on a substrate surface or thin film where the size and distribution are controlled in detail. SOLUTION: The surface processing method includes a process for spraying fine particles on an object to be processed, and a process for plasma-processing the object with the fine particles as a mask. COPYRIGHT: (C)2007,JPO&INPIT