METHOD OF MANUFACTURING LAMINATED ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated electronic component capable of acquiring low resistance and high DC superimposition characteristic even if it is miniaturized. SOLUTION: In the method of manufacturing a laminated electronic component, the following processes are repeated: a process of printing a conductive pattern on an insulation layer, forming non-magnetic portions 12A-12G between both ends of the conductor pattern, forming a loop pattern by the conductor pattern and the non-magnetic portions 12A-12G on the insulation layer and pressurizing the loop pattern; a process of printing a magnetic paste on a part other than the loop pattern on the insulation layer to form a first magnetic portion, and pressurizing the first magnetic portion so that the surface of the first magnetic portion can be positioned on the same surface of the loop pattern surface; a process of printing a non-magnetic paste on a part other than one end on the conductive pattern to form a non-magnetic portion, forming a conductor on an end of the conductor pattern, and pressurizing the loop pattern; and a process of printing a magnetic paste on the first magnetic portion to form a second magnetic portion, and pressurizing the second magnetic portion so that the surface of the second magnetic portion can be positioned on the same plane of the loop pattern surface. Then, a coil pattern is formed in a laminated body. COPYRIGHT: (C)2007,JPO&INPIT