BONDING DEVICE, TRANSPORT DEVICE FOR SEMICONDUCTOR CHIP, BONDING METHOD, AND TRANSPORT METHOD FOR SEMICONDUCTOR CHIP

PROBLEM TO BE SOLVED: To provide a bonding device, a transport device for a semiconductor chip, a bonding method, and a transport method for a semiconductor chip that are used for controlling a load applied to a semiconductor chip at a constant level, when the semiconductor chip is die-bonded to a base or when it is transported between the bases. SOLUTION: A belt 3 is slidably hung to pulleys 8 as a bonding head or a suction head, and both ends of the belt are hung down. A first slider 4 has a first weight and vertically slides, and is suspended from one end of the belt. A second slider 7 has a second weight lighter than the first weight and vertically slides, and is suspended from the other end of the belt. A suction collet 6 for the semiconductor chip is provided to the lower end of the first slider. The relative height of the second slider to the first slider is reduced after the semiconductor chip 10 attached to the collet while being sucked is pressed against onto the base 5. Consequently, a load of a difference between the first/second weights is applied to the semiconductor chip from the collet. COPYRIGHT: (C)2007,JPO&INPIT