BUMP AND ITS FORMATION METHOD

PROBLEM TO BE SOLVED: To provide a bump which has excellent durability enough to be stably for a long time, and to provide its formation method. SOLUTION: The bump is formed by sintering one or more kinds of metallic powder selected among a gold powder, a silver powder, a plutinum powder, or a parad...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOGASHIWA TOSHINORI, MIYAIRI MASAYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER PERFORMING OPERATIONS POWDER METALLURGY SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER
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