BUMP AND ITS FORMATION METHOD
PROBLEM TO BE SOLVED: To provide a bump which has excellent durability enough to be stably for a long time, and to provide its formation method. SOLUTION: The bump is formed by sintering one or more kinds of metallic powder selected among a gold powder, a silver powder, a plutinum powder, or a parad...
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| creator | KOGASHIWA TOSHINORI MIYAIRI MASAYUKI |
| description | PROBLEM TO BE SOLVED: To provide a bump which has excellent durability enough to be stably for a long time, and to provide its formation method. SOLUTION: The bump is formed by sintering one or more kinds of metallic powder selected among a gold powder, a silver powder, a plutinum powder, or a paradium powder whose purity is 99.9 wt% and average particle size is 0.005-1.0 μm. The particular shape of the metallic powder after sintered and that before sintered are nearly identical, and a material structure shows surface-contact state of the metallic powder particles. In this case, sintering temperature (Ts) during sintering is set to a temperature range that the melting point (Tm) of the metallic powder is multiplied by 0.3-0.50. COPYRIGHT: (C)2007,JPO&INPIT |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS CASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER PERFORMING OPERATIONS POWDER METALLURGY SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER |
| title | BUMP AND ITS FORMATION METHOD |
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