FLIP-CHIP SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a flip-chip semiconductor device wherein any damage to the active plane of a semiconductor chip can be prevented even if the semiconductor chip and a circuit board are deformed when heat and a load are applied. SOLUTION: In the flip-chip semiconductor device 1, subst...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUJII TOSHIO, TAKEOKA YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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