FLIP-CHIP SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a flip-chip semiconductor device wherein any damage to the active plane of a semiconductor chip can be prevented even if the semiconductor chip and a circuit board are deformed when heat and a load are applied. SOLUTION: In the flip-chip semiconductor device 1, substrate-side electrodes 7 formed on the circuit board 2 and a chip-side electrode formed on the semiconductor chip 3 are electrically connected via bumps 4. The semiconductor chip 3 is bonded to the circuit board 2 via an adhesive resin material 9 interposed between the circuit board 2 and the semiconductor chip 3. The adhesive resin material 9 contains an inorganic filler 10 distributed therein. About the substrate-side electrodes 7 and 8, the thickness T of the electrodes 7 bonded to the bumps 4 is larger than the thickness (t) of the electrode 8 which is not bonded to the bumps 4. COPYRIGHT: (C)2007,JPO&INPIT