BOND COAT FOR SILICON-CONTAINING SUBSTRATE FOR EBC AND MANUFACTURING PROCESS THEREOF

PROBLEM TO BE SOLVED: To provide a manufacturing process which can achieve the adhesion to a substrate even if the space between an environmental barrier coating (EBC) and the substrate is exposed to an effective contact surface temperature exceeding about 1,204°C. SOLUTION: An article 12 comprising...

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Bibliographische Detailangaben
Hauptverfasser: BOUTWELL BRETT A, HAZEL BRIAN T, SPITSBERG IRENE
Format: Patent
Sprache:eng
Schlagworte:
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