BOND COAT FOR SILICON-CONTAINING SUBSTRATE FOR EBC AND MANUFACTURING PROCESS THEREOF

PROBLEM TO BE SOLVED: To provide a manufacturing process which can achieve the adhesion to a substrate even if the space between an environmental barrier coating (EBC) and the substrate is exposed to an effective contact surface temperature exceeding about 1,204°C. SOLUTION: An article 12 comprising a silicon-containing substrate 30, a silicon compound-containing bonding coat layer 42 applied on the substrate 30 and an environmental barrier coating 50 typically applied on the bonding coat layer 42 is provided. A process for forming the silicon compound-containing bonding coat layer 42 on the substrate 30, followed by forming the environmental barrier coating 50 on the bonding coat layer 42 is provided. Some embodiments of the article and the process bring a number of advantages and benefits to an article comprising a silicon-containing substrate having the environmental barrier coating (EBC). COPYRIGHT: (C)2007,JPO&INPIT