ETCHING AGENT, ETCHING METHOD, AND FORMED LAMINATE AND DEVICE

PROBLEM TO BE SOLVED: To provide an etching agent used for a chemical wet etching method of chemical-resistant crystal material. SOLUTION: The etching agent is provided containing a cryolite (Na3AlF6) and a halogen salt like a potassium tetrafluoroborate (KBF4). The salt exists in the etching agent...

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Hauptverfasser: ROBERT JOHN WOJNAROWSKI, STEVEN ALFRED TYSOE, BECKER CHARLES A, STEVEN FRANCIS LEBOEUF, VINAYAK TILAK, ARTHUR STEPHEN D, EBONG ABASIFREKE U, VENKAT SUBRAMANIAM VENKATARAMANI, DEVELYN MARK PHILIP, SUBRAMANIAN KANAKASABAPATHI, FORTIN JEFFREY BERNARD, SAMHITA DASGUPTA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an etching agent used for a chemical wet etching method of chemical-resistant crystal material. SOLUTION: The etching agent is provided containing a cryolite (Na3AlF6) and a halogen salt like a potassium tetrafluoroborate (KBF4). The salt exists in the etching agent in sufficient amount for etching a support layer, and can have a melting temperature exceeding about 200°C. The wet etching method includes the steps of contacting the etching agent containing the cryolite and/or the potassium tetrafluoroborate on one or more surfaces of the support layer 130 containing the aluminum oxide of a multilayer laminate, and then etching at least the part of the support layer 130. An independent laminate is provided containing a gallium nitride manufactured by crystal growth on the aluminum oxide support layer 130. COPYRIGHT: (C)2007,JPO&INPIT