THREE-DIMENSIONAL MICROSTRUCTURE MEASURING METHOD

THREE-DIMENSIONAL MICROSTRUCTURE MEASURING METHOD

PROBLEM TO BE SOLVED: To provide a method for evaluating the height of microscopic uneveness over the entire area of a substrate across the substrate, in a short time. SOLUTION: Slit light 11, which is a linear light, irradiates the surface of an uneven substrate 13, which is an object under measure...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: IKURA TSUNEO, INOUE RYUICHI, ISHIKURA YASUHISA
Format: Patent
Sprache:eng
Schlagworte:
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
PHYSICS
TESTING
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for evaluating the height of microscopic uneveness over the entire area of a substrate across the substrate, in a short time. SOLUTION: Slit light 11, which is a linear light, irradiates the surface of an uneven substrate 13, which is an object under measurement. A slit projection optical image 14, which is reflected light of the slit light 11, is acquired by photographing with a photographic camera 15, which is a photographic means, via an optical system optical path, including an anisotropic magnifying power lens 16. Using the acquired slit projection optical image, the asperities on the surface of the uneven substrate 13 are measured. COPYRIGHT: (C)2007,JPO&INPIT