HEAT DISSIPATION SUBSTRATE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a heat dissipation substrate having a high heat dissipation property and a coefficient of thermal expansion in conformity with an element to be mounted, and also to provide a low-cost manufacturing method of the same. SOLUTION: The heat dissipation substrate is for m...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	CHIKUNO TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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