HEAT DISSIPATION SUBSTRATE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a heat dissipation substrate having a high heat dissipation property and a coefficient of thermal expansion in conformity with an element to be mounted, and also to provide a low-cost manufacturing method of the same. SOLUTION: The heat dissipation substrate is for m...

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Bibliographische Detailangaben
1. Verfasser:	CHIKUNO TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DEVICES USING STIMULATED EMISSION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat dissipation substrate having a high heat dissipation property and a coefficient of thermal expansion in conformity with an element to be mounted, and also to provide a low-cost manufacturing method of the same. SOLUTION: The heat dissipation substrate is for mounting a laser diode having a layer structure consisting of at least two layers, and is formed with a plurality of parallel grooves along one side of the substrate on at least part of the outermost layer. The plurality of parallel grooves are formed by etching or laser processing along one side of the substrate on at least part of the outermost layer of the heat dissipation substrate having a layer structure consisting of at least two layers. COPYRIGHT: (C)2007,JPO&INPIT