WIRING BOARD AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a wiring board having reliability by a simple manufacturing method. SOLUTION: The wiring board 10 is comprised of a flexible part 14 and a rigid part 15 that is formed continuously to the flexible part 14. The flexible part 14 comprises a flexible board, wherein a wi...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TAKENOUCHI TAKAHIRO, KYOZUKA MASAHIRO, WATANABE SHOJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a wiring board having reliability by a simple manufacturing method. SOLUTION: The wiring board 10 is comprised of a flexible part 14 and a rigid part 15 that is formed continuously to the flexible part 14. The flexible part 14 comprises a flexible board, wherein a wiring pattern 13 is stacked with an insulating resin layer 12 in-between, and the rigid part 15 is comprised of a flexible board made integrally with the flexible part 14, and the wiring density of the wiring pattern formed on the flexible board is set to be higher than that of the flexible part 14, resulting in permitting higher hardness for the wiring pattern than that of the flexible part 14. COPYRIGHT: (C)2007,JPO&INPIT