TAPE PACKAGE PREVENTING CRACK AT LEAD BONDING

PROBLEM TO BE SOLVED: To provide a tape package which prevents formation of cracks at outer lead bonding of the bonding output leads of the tape package, to a glass panel. SOLUTION: The tape package has solder resist that covers input lead wiring and the part of output lead wiring, excluding their t...

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Bibliographische Detailangaben
Hauptverfasser:	CHUNG YEUNG, KYO SHIIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a tape package which prevents formation of cracks at outer lead bonding of the bonding output leads of the tape package, to a glass panel. SOLUTION: The tape package has solder resist that covers input lead wiring and the part of output lead wiring, excluding their terminations. A wiring failure preventive means, having an expanded lead width, is formed on the part of the exposed output lead wiring that does not have solder resist coating connected to wiring on the glass panel, that is, a region of the exposed output lead wiring, where cracks tend to develop. COPYRIGHT: (C)2007,JPO&INPIT