DEVICE FOR HEATING WAFER AND DEVICE FOR MANUFACTURING SEMICONDUCTOR USING IT

PROBLEM TO BE SOLVED: To solve the problem that a heater can not be cooled in a short time if heating the wafer of a large size ≥300 mm since it is difficult to substantially increase the supply amount of cooling gas, even when the cooling gas is supplied to the heater in a conventional device for heating wafer. SOLUTION: The device for heating wafer 1 comprises: the heater provided with an insulation layer 14 on one main surface of a planar body 2, provided with a belt-like resistor heating element 5 on the insulation layer 14, and provided with a mounting surface 3 for mounting the wafer W on the other main surface; a power feeding terminal 11 for supplying power to the resistor heating element 5; and a case 19 connected with the planar body 2 so as to wrap the power feeding terminal 11. The case 19 is provided with a nozzle 24 for cooling the heater and an opening 23, and the distal end of the nozzle 24 is positioned between the resistor heating elements 5 in the view from a projection plane to the mounting surface 3. Since the cooling time of the heater can be shortened and the cooling time of the wafer can be shortened, wafer processing time in a semiconductor manufacturing process can be shortened. COPYRIGHT: (C)2007,JPO&INPIT