PRESS WIRING PLATE AND ITS INSERT MOLDING METHOD

PROBLEM TO BE SOLVED: To provide a press wiring plate capable of sealing a resin surface without post-treatment. SOLUTION: In the insert shaping method, press wiring 12 is set in a cavity 11 of a lower mold 4. When an upper mold 6 is closed for resin molding, a lower mold holding pin 5 and an upper...

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Bibliographische Detailangaben
Hauptverfasser:	SUDO MITSURU, HOSOGAYA TAKASHI, NISHIMURA YOSHIMICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a press wiring plate capable of sealing a resin surface without post-treatment. SOLUTION: In the insert shaping method, press wiring 12 is set in a cavity 11 of a lower mold 4. When an upper mold 6 is closed for resin molding, a lower mold holding pin 5 and an upper mold holding pin 7 are set in the lower mold 4 and the upper mold 6, respectively, so that the press wiring 12 is neither moved nor deformed during injecting the resin in the case of closing the molds and conducting the injection molding. Since the lower mold holding pin 5 and the upper mold holding pin 7 are shaped so that diameters a and b of the pins are smaller than strokes A and B protruding to the cavity, it is possible to retard the cooling of the resin in the vicinity of the pins by its narrow portion effect and fill the resin to the cavity made by pulling out the pins from the surrounding. COPYRIGHT: (C)2007,JPO&INPIT