ELECTRONIC COMPONENT BONDING DEVICE

PROBLEM TO BE SOLVED: To provide a concrete configuration of an electronic component bonding device which can stabilize conduction between a terminal section and an electrode section, and ensuring bonding strength between a substrate and electronic components. SOLUTION: The electronic component bond...

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Bibliographische Detailangaben
1. Verfasser:	NEHASHI TORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a concrete configuration of an electronic component bonding device which can stabilize conduction between a terminal section and an electrode section, and ensuring bonding strength between a substrate and electronic components. SOLUTION: The electronic component bonding device 1 is provided with a vibration head 7 for performing compression bonding between the terminal section on a substrate 2 and the electrode section on an electronic component 4; and a heater 8 for thermally curing a thermosetting insulation resin provided on the substrate 2 to perform adhesion and bonding the substrate 2 and the electronic component 4. In this bonding device 1, the heater 8 abuts on the vibration head 7 via a shock absorbing member. COPYRIGHT: (C)2007,JPO&INPIT