METHOD OF MANUFACTURING METAL-CLAD POLYIMIDE SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal-clad plastic substrate having a metal layer formed, by sputtering on a polyimide film surface which improves the adhesive strength of the metal layer made by sputtering to the metal film surface and the long-time stability under high...

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Bibliographische Detailangaben
1. Verfasser:	OGASAWARA SHUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a metal-clad plastic substrate having a metal layer formed, by sputtering on a polyimide film surface which improves the adhesive strength of the metal layer made by sputtering to the metal film surface and the long-time stability under high-temperature environment. SOLUTION: The method of manufacturing a metal-clad plastic substrate, having a metal layer formed by sputtering on a polyimide film surface comprises treating the surface of the polyimide film surface with an alkali water solution of 0.001-10 mol/L concentration, prior to forming the metal layer, and then treating it with a polar organic solvent held at 20-40°C. COPYRIGHT: (C)2007,JPO&INPIT