PACKAGE FOR STORING ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide a package for storing an electronic component which can reduce transmission strain caused by an increase in inductance of a ground circuit of an electronic component inside the package and can also reduce the occurrence of steam inside the package, etc. SOLUTION: The package A for storing an electronic component includes a thermoelectric module 5 attached to a portion of the bottom face of a metal base 1 which faces a mounting portion 1a. Since the ground circuit of the electronic component is not mediated by the thermoelectric module 5, it can be made short. Moreover, the package suffers from less influence by moisture, etc. trapped inside when the thermoelectric module 5 is attached inside the package. COPYRIGHT: (C)2007,JPO&INPIT