PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE FILM USING SAME

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition usable as a photosensitive adhesive, capable of sufficiently suppressing outgassing in heat curing, capable of ensuring sufficiently low hygroscopicity, water-absorbing property and moisture permeability after curing, and having goo...

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Bibliographische Detailangaben
Hauptverfasser:	TSUKADA KATSUSHIGE, NAGOSHI TOSHIMASA, TSUCHIYA KATSUNORI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a photosensitive resin composition usable as a photosensitive adhesive, capable of sufficiently suppressing outgassing in heat curing, capable of ensuring sufficiently low hygroscopicity, water-absorbing property and moisture permeability after curing, and having good adhesion to glass and good storage stability. SOLUTION: The photosensitive resin composition contains (a) a bismaleimide compound, (b) a polymer or prepolymer having two or more allyl groups per molecule and a weight average molecular weight of 3,000-50,000, (c) an organic peroxide, (d) a photopolymerizable ethylenically unsaturated compound having two or more (meth)acryloyloxy groups per molecule, and (e) a photopolymerization initiator. COPYRIGHT: (C)2007,JPO&INPIT