DISPENSATION NOZZLE

PROBLEM TO BE SOLVED: To provide a dispensation nozzle capable of coating a substrate surface with an adhesive with uniform thickness when adhering a semiconductor element and a slid-state image pickup element to a substrate. SOLUTION: There is provided a discharge part 16 having a cylindrical barre...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	YAMADA HIDE
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL PERFORMING OPERATIONS SPRAYING OR ATOMISING IN GENERAL TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a dispensation nozzle capable of coating a substrate surface with an adhesive with uniform thickness when adhering a semiconductor element and a slid-state image pickup element to a substrate. SOLUTION: There is provided a discharge part 16 having a cylindrical barrel 16a of the dispensation nozzle 11 discharging an adhesive to the substrate W and an opening 16c discharging an adhesive along the center axis of the barrel part, and a smaller diameter part than the diameter of the barrel part is formed at the top end part 16b of the side discharging the adhesive of the discharge part. COPYRIGHT: (C)2007,JPO&INPIT