SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To stabilize a power supply and a ground potential by a power plane and a ground plane by providing a semiconductor device which has a package substrate comprising a two-layer wiring structure with a small number of external connection terminals. SOLUTION: The semiconductor device is constituted by mounting a semiconductor device 3 on a two-layer packaging substrate 2. The external connection terminals of the two-layer packaging substrate 2 are sorted into two kinds of terminals 5E and 5C of an external periphery and a center. In the first wiring layer L1 of the package substrate 2, a first electrode plane connecting to terminals which are arranged more in an innermost periphery of array-like arrangement out of a power terminal VDDC for internal circuit and a ground terminal GNDC for internal circuit is formed. On the other hand, in a second wiring layer L2, a second electrode plane connecting to terminals which are arranged more in an outermost periphery of the array-like arrange is formed at a position overlapping with the first electrode plane. Even when the wiring layer is double, leading-around of the wiring via a through hole, etc. across wiring layers is reduced when the stability of a power source is provided by forming the power plane and the ground plane for the power source for internal circuit and its ground, respectively. COPYRIGHT: (C)2007,JPO&INPIT