METHOD AND SYSTEM FOR IMPROVED PACKAGE SUBSTRATE TO BE USED WITH SEMICONDUCTOR PACKAGE

PROBLEM TO BE SOLVED: To provide a method of improving impedance matching of signal lines in a semiconductor package substrate. SOLUTION: Systems and methods for a substrate for a package substrate for to be used in the semiconductor package are disclosed. Package substrates formed according to the systems and methods may exhibit improved signal integrity and quality. In order to achieve this increase signal integrity, these systems and methods may endeavor to realize equalization, i. e. matching of impedances in signal lines in or on the package substrate by removing material from one or more layers of a package substrate in a region of high signal density. Removing the material from these layers may serve to increase the impedance of a signal line within a region of high signal density so that the impedance of the signal line with the region of high signal density is substantially matched to the impedance of the signal line outside the region of high-signal density. COPYRIGHT: (C)2007,JPO&INPIT