METHOD OF BONDING SUBSTRATES, METHOD OF FORMING CHIP, AND CHIP

PROBLEM TO BE SOLVED: To provide a bonding method of enabling substrates to be bonded without causing damage to the substrate. SOLUTION: A bonding method of bonding a first substrate 10 and a second substrate 20 is presented which comprises steps of making a main body of at least one of the first substrate 10 and the second substrate 20 with a light-transmissive material that transmits light; forming at least a part of the surfaces of the first substrate 10 and the second substrate 20 to be bonded with a thermoplastic resin, containing a light absorbing agent 23 that absorbs light; and bonding the first substrate 10 and the second substrate 20 by irradiating the light-absorbing agent 23, on the surface to be bonded with light through the substrate that transmits light. COPYRIGHT: (C)2007,JPO&INPIT