SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor device which can be increased in packaging density and can accurately shut out electromagnetic waves, and also to provide its manufacturing method. SOLUTION: On a sealing resin 14 which has difficulty in forming a conductive film thereon, a resin laye...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMADA NORIJI, KAJIKI ATSUNORI, SHIMIZU HIROSHI, INOUE AKIYOSHI, KATO HIROYUKI, KOBAYASHI TOMOKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor device which can be increased in packaging density and can accurately shut out electromagnetic waves, and also to provide its manufacturing method. SOLUTION: On a sealing resin 14 which has difficulty in forming a conductive film thereon, a resin layer 15 is formed whose adhesiveness with the conductive film is higher than the sealing resin 14. Then, a wiring pattern 18 electrically connected to an electronic component 13 is arranged on the resin layer 15. COPYRIGHT: (C)2007,JPO&INPIT