MULTI-LAYER LAMINATE AND FLEXIBLE COPPER-CLAD LAMINATED SUBSTRATE

PROBLEM TO BE SOLVED: To provide a multi-layer laminate which is reduced in the curling of a flexible copper-clad laminated substrate after peeling off a carrier foil and is excellent in the adhesion strength between an ultra-thin copper foil and a resin layer. SOLUTION: The multi-layer laminate has...

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Bibliographische Detailangaben

Hauptverfasser:	UENO MASATO, TAKARABE TAEKO, MATSUSHITA SUKEYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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