MULTI-LAYER LAMINATE AND FLEXIBLE COPPER-CLAD LAMINATED SUBSTRATE

PROBLEM TO BE SOLVED: To provide a multi-layer laminate which is reduced in the curling of a flexible copper-clad laminated substrate after peeling off a carrier foil and is excellent in the adhesion strength between an ultra-thin copper foil and a resin layer. SOLUTION: The multi-layer laminate has the resin layer formed by applying a resin solution on the ultra-thin copper foil of an ultra-thin copper foil with a heat-resistant carrier foil. At least a polyimide resin layer contacting with the ultra-thin copper foil and an outermost polyimide resin layer are high thermal expansion resin layers between which a low thermal expansion resin layer exists wherein the ratio (ta/tc) of the thickness of the high thermal expansion resin layer contacting the conductive foil tato the thickness of the outermost high thermal expansion resin layer tcis 0.25-0.95, the total thickness of the whole resin layers is 10-50 μm and the thermal expansion coefficient of the whole resin layers is (15 to 25)×10-6(1/K). COPYRIGHT: (C)2007,JPO&INPIT