APPLICATOR

PROBLEM TO BE SOLVED: To uniformly spread a liquid in a vessel body around the overall circumference of an outer surface of a pen tip of a flat fiber-bundled material. SOLUTION: In this applicator in which a coating-liquid lead-out body is arranged at the pen tip of the flat fiber-bundled material,...

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Bibliographische Detailangaben
1. Verfasser: USAMI HIDEYUKI
Format: Patent
Sprache:eng
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