SHRINK FILM WITH NON-CONTACT TYPE IC TAG AND ARTICLE WITH NON-CONTACT TYPE IC TAG
PROBLEM TO BE SOLVED: To provide a heat-shrinkable film provided with an IC tag inlet capable of easily mounting the IC tag inlet to a commodity main body or a package of a commodity, and the commodity using the same. SOLUTION: In this shrink film with an IC tag, a pressure-sensitive adhesive layer...
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Format: | Patent |
Sprache: | eng |
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