SHRINK FILM WITH NON-CONTACT TYPE IC TAG AND ARTICLE WITH NON-CONTACT TYPE IC TAG

PROBLEM TO BE SOLVED: To provide a heat-shrinkable film provided with an IC tag inlet capable of easily mounting the IC tag inlet to a commodity main body or a package of a commodity, and the commodity using the same. SOLUTION: In this shrink film with an IC tag, a pressure-sensitive adhesive layer...

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Bibliographische Detailangaben
1. Verfasser:	TAKESHIMA AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR ADVERTISING BOOK COVERS BOOKBINDING CALCULATING COMPUTING CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING COUNTING CRYPTOGRAPHY DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDEDFOR DISPLAY DISPLAYING EDUCATION FILES HANDLING RECORD CARRIERS HANDLING THIN OR FILAMENTARY MATERIAL LABELS OR NAME-PLATES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LOOSE LEAVES MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS MOVABLE-STRIP WRITING OR READING APPARATUS PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS PHYSICS PRESENTATION OF DATA PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITYFEATURES PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOTOTHERWISE PROVIDED FOR RECOGNITION OF DATA RECORD CARRIERS SEALS SIGNS SPECIAL PRINTED MATTER STORING TRANSPORTING UNPACKING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a heat-shrinkable film provided with an IC tag inlet capable of easily mounting the IC tag inlet to a commodity main body or a package of a commodity, and the commodity using the same. SOLUTION: In this shrink film with an IC tag, a pressure-sensitive adhesive layer 2 is provided on the back of a heat-shrinkable film layer 1 composed of a uniaxially or biaxially stretched film punched into a small piece shape and the IC tag inlet 3 is attached or arranged to the heat-shrinkable film layer 1 through the pressure-sensitive adhesive layer 2 or attached and arranged between the heat-shrinkable film layer 1 and the pressure-sensitive adhesive layer 2. COPYRIGHT: (C)2007,JPO&INPIT