WAFER CLEANING APPARATUS AND WAFER CLEANING METHOD

PROBLEM TO BE SOLVED: To provide a compact wafer cleaning apparatus capable of uniformly cleaning both surfaces of a substrate. SOLUTION: The wafer cleaning apparatus comprises a sensor 12 for detecting the carrying-in of a wafer 1 carried in longitudinally; a cleaning nozzle 11 for spraying pure wa...

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Bibliographische Detailangaben
Hauptverfasser: MATSUDA TAKAMASA, TAKAUO TSUTOMU, SAKAMOTO ISAO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a compact wafer cleaning apparatus capable of uniformly cleaning both surfaces of a substrate. SOLUTION: The wafer cleaning apparatus comprises a sensor 12 for detecting the carrying-in of a wafer 1 carried in longitudinally; a cleaning nozzle 11 for spraying pure water compressed by both the surfaces of the wafer 1 while the sensor 12 detects the wafer 1; a roll-shaped cleaning brush 4 for brush-cleaning both the surfaces of the wafer 1 carried to a predetermined position, while making a brush contacts with both the surfaces of the wafer by predetermined pressure; and an ultrasonic jet nozzle 14 for blowing megasonic pure water of a predetermined ultrasonic frequency to the wafer 1 at a predetermined angle, and cleaning the both the surfaces of the wafer 1 after cleaning by the cleaning brush 4. The cleaning nozzle 11 for spraying pure water has an oscillating mechanism that changes a spraying direction, and removes adhered contamination by changing the spraying direction to the cleaning brush 4 with the aid of the oscillating mechanism when the wafer 1 is deviated a sensing region of the sensor 12. COPYRIGHT: (C)2007,JPO&INPIT