FITTING STRUCTURE OF HEAT SINK AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide the fitting structure of a heat sink, wherein no load is given to generate warpage of a control circuit board with specified parts, and faults, such as peeling, cracking of a solder for mounting parts, peeling of a circuit pattern on the substrate can be prevented. S...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMAGUCHI MASANOBU, HANAMURA HIDEKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!