FITTING STRUCTURE OF HEAT SINK AND ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide the fitting structure of a heat sink, wherein no load is given to generate warpage of a control circuit board with specified parts, and faults, such as peeling, cracking of a solder for mounting parts, peeling of a circuit pattern on the substrate can be prevented. SOLUTION: There are provided a control circuit board 9 with specified parts, a heat generating bodies 11 and 12 mounted to the control circuit board; a heat sink 18 which is in contact with the heat generating body to radiate a heat therefrom; a first retaining plate 14 provided with a contact 15, which is in contact with a surface of the control circuit board on which the heat generator is mounted, as well as the rear surface thereof; and a second retaining plate 20, of which a part is in contact with the heat sink and pinches/retains the control circuit board, the heat generating body, and the heat sink together with the first retaining plate in the direction of thickness of the control circuit board. The first and second retaining plates are joined to each other in the direction of thickness of the control circuit board, thus reducing the contact area of the contact of the first retaining plate to the control circuit board to be smaller than the fitting area of the heat generating body to the control circuit board, as well as placing the contact section within the external shape of the heat generating body, in correspondence. COPYRIGHT: (C)2007,JPO&INPIT