METHOD OF ASSEMBLING INSPECTION DEVICE FOR SEMICONDUCTOR SUBSTRATE

PROBLEM TO BE SOLVED: To easily and precisely regulate a relative position of a probe pin of a contact block with respect to a pitch conversion substrate. SOLUTION: Positions of through-holes 26A, 26B, 26C, 26D of the contact block 26 are conformed with positioning marks 24MA, 24MB, 24MC, 24MD of th...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI TAKESHI, UJIIE AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To easily and precisely regulate a relative position of a probe pin of a contact block with respect to a pitch conversion substrate. SOLUTION: Positions of through-holes 26A, 26B, 26C, 26D of the contact block 26 are conformed with positioning marks 24MA, 24MB, 24MC, 24MD of the pitch conversion substrate 24, when assembling, to position the relative position of the probe pin 28ai with respect to an electrode group 24E of the pitch conversion substrate 24. COPYRIGHT: (C)2007,JPO&INPIT