MANUFACTURING METHOD OF EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR, EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR AND ELECTRONIC COMPONENT DEVICE USING IT

PROBLEM TO BE SOLVED: To provide a manufacturing method of an epoxy resin composition for sealing a semiconductor which perfectly eliminates the contact chance with moisture of kneaded matter or a ground product and extremely reduces trouble in a sheeting and cooling process, the epoxy resin composi...

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Bibliographische Detailangaben
Hauptverfasser:	HIRANO TAKUYA, KUROSU NOBORU, KOSHINUMA ATSUSHI, KOBAYASHI RIKIYA, EBIHARA HIDEKI, SHINPO TAKAFUMI, HIMORI TAKENOBU, ISHIGAWARA MITSUO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MAKING GRANULES OR PREFORMS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method of an epoxy resin composition for sealing a semiconductor which perfectly eliminates the contact chance with moisture of kneaded matter or a ground product and extremely reduces trouble in a sheeting and cooling process, the epoxy resin composition for the semiconductor and an electronic component device using it. SOLUTION: The manufacturing method of the epoxy resin composition for sealing the semiconductor containing an epoxy resin, a curing agent and an inorganic filler has a process for mixing a raw material containing the epoxy resin, the curing agent and the inorganic filler and kneading the same in a kneader to obtain the kneaded matter, a process for rolling the kneaded matter into a sheetlike form by a rolling roll, a process for cooling the rolled material in a low temperature gas while feeding the same by a cooling conveyor, a process for grinding the rolled material by a grinder to obtain the ground product and a process for compression-molding the ground product. COPYRIGHT: (C)2007,JPO&INPIT