SEMICONDUCTOR INTEGRATED CIRCUIT

PROBLEM TO BE SOLVED: To reduce the number of components on a printed circuit by mounting a plurality of discrete electronic components on a semiconductor chip. SOLUTION: The surface of the semiconductor chip in which a plurality of connection electrodes are provided is covered with a lower insulating film so that the connection electrodes are exposed. A plurality of wiring patterns, in which one end is connected to the connection electrodes and a connection part for the components is provided in the other end, are formed on the lower insulating film. The wiring patterns are covered with an upper insulating film so that the connection part for the components is exposed. The discrete electronic components are connected between different connection parts for the components. COPYRIGHT: (C)2007,JPO&INPIT