SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

PROBLEM TO BE SOLVED: To provide a semiconductor module and a method for manufacturing the same. SOLUTION: The semiconductor module includes at least one semiconductor chip package 150, a board having normal pads 130 and dummy pads 132, and at least one solder joint 112 electrically connecting the s...

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Hauptverfasser: KIM BYUNG-MAN, SEN KOKO, PARK SHOYO, SHIN DONG-WOO, KIM KWANG-SEOP, LEE DONGUN, KIM YONG-HYUN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator KIM BYUNG-MAN
SEN KOKO
PARK SHOYO
SHIN DONG-WOO
KIM KWANG-SEOP
LEE DONGUN
KIM YONG-HYUN
description PROBLEM TO BE SOLVED: To provide a semiconductor module and a method for manufacturing the same. SOLUTION: The semiconductor module includes at least one semiconductor chip package 150, a board having normal pads 130 and dummy pads 132, and at least one solder joint 112 electrically connecting the semiconductor chip package 150 and one of the normal pads 130 of the board. Furthermore, at least one supporting solder bump 102 is formed on one of the dummy pads 132 and disposed under a portion of the semiconductor chip package 150. For example, the supporting solder bump 102 may be disposed under a peripheral area of the semiconductor chip package 150. COPYRIGHT: (C)2007,JPO&INPIT
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME
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