SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME

PROBLEM TO BE SOLVED: To provide a semiconductor module and a method for manufacturing the same. SOLUTION: The semiconductor module includes at least one semiconductor chip package 150, a board having normal pads 130 and dummy pads 132, and at least one solder joint 112 electrically connecting the s...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIM BYUNG-MAN, SEN KOKO, PARK SHOYO, SHIN DONG-WOO, KIM KWANG-SEOP, LEE DONGUN, KIM YONG-HYUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a semiconductor module and a method for manufacturing the same. SOLUTION: The semiconductor module includes at least one semiconductor chip package 150, a board having normal pads 130 and dummy pads 132, and at least one solder joint 112 electrically connecting the semiconductor chip package 150 and one of the normal pads 130 of the board. Furthermore, at least one supporting solder bump 102 is formed on one of the dummy pads 132 and disposed under a portion of the semiconductor chip package 150. For example, the supporting solder bump 102 may be disposed under a peripheral area of the semiconductor chip package 150. COPYRIGHT: (C)2007,JPO&INPIT