CARRIER HOLDER OF SUBSTRATE FOR TREATING SUBSTRATE SURFACE

PROBLEM TO BE SOLVED: To attain the simplification of an etching process of forming a texture shape to one surface and a flat shape to the other surface particularly in relation with the etching of the silicon substrate of a mass production type solar cell for a residence. SOLUTION: Generally, altho...

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Bibliographische Detailangaben
Hauptverfasser: HAGINO KIMITO, OTAKE YASUTOSHI, SATO HIROTAKA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To attain the simplification of an etching process of forming a texture shape to one surface and a flat shape to the other surface particularly in relation with the etching of the silicon substrate of a mass production type solar cell for a residence. SOLUTION: Generally, although the surface treatment of the substrate carries out equally in the front and rear sides of the substrate, it is desirable that the front surface is a texture shape and the rear surface is a flat shape. In case surface treatment of the semiconductor substrate is carried out, an exothermic reaction occurs. Moreover, a reaction speed at the time of the surface treatment becomes quick by a temperature rise, and the surface shape changes with the progress of the reaction. This carrier holder 22 stays the reaction heat on the surface with a proximity element by providing the proximity object in one surface of a semiconductor substrate at the time of surface treatment. Since the reaction heat is then taken by the convection of an etchant on the other hand, a temperature gradient occurs between the one surface of the semiconductor substrate and the other surface. The semiconductor substrate with the texture shape in one surface and a comparatively flat shape easily by one treatment in the other surface, and the simplification of the etching process can be performed. COPYRIGHT: (C)2007,JPO&INPIT