ASSEMBLY AND METHOD FOR ELECTROPOLISHING ELECTROCONDUCTIVE LAYER

PROBLEM TO BE SOLVED: To provide an apparatus and a method for electropolishing an electroconductive film on a wafer. SOLUTION: The apparatus comprises a wafer chuck (1002) for holding a wafer, an actuator (1000) for rotating the wafer chuck, and a nozzle (1010) constructed so as to electropolish th...

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Bibliographische Detailangaben
Hauptverfasser:	NUCH VOHA, AFNAN MUHAMMED, GUTMAN FELIX, YIH PEIHAUR, WANG HUI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE PERFORMING OPERATIONS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS SEMICONDUCTOR DEVICES SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL TRANSPORTING WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OFELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKESTHE PLACE OF A TOOL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an apparatus and a method for electropolishing an electroconductive film on a wafer. SOLUTION: The apparatus comprises a wafer chuck (1002) for holding a wafer, an actuator (1000) for rotating the wafer chuck, and a nozzle (1010) constructed so as to electropolish the wafer. It is also possible that the apparatus further comprises an electroconductive ring or shroud (1006). The method for electropolishing an electroconductive film on a wafer comprises rotating a wafer chuck at a velocity sufficient for an electrolyte fluid injected onto the wafer to flow toward the wafer edge on the surface of the wafer. COPYRIGHT: (C)2007,JPO&INPIT