MICROPROCESSING MOLD

PROBLEM TO BE SOLVED: To provide a microprocessing mold constituted so as to be easily supported on a press machine in forming a microstructure on a substrate by a nano-imprinting method, a hot embossing method or the like, preventing the deformation or distortion caused by pressure and heating at t...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	HIRANO TAKAYUKI, TACHIBANA TAKESHI, KOHORI TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a microprocessing mold constituted so as to be easily supported on a press machine in forming a microstructure on a substrate by a nano-imprinting method, a hot embossing method or the like, preventing the deformation or distortion caused by pressure and heating at the time of pressing and capable of performing microprocessing with high precision at a low cost. SOLUTION: The microprocessing mold is constituted by joining a thin piece mold 2 having a microstructure formed thereto and a pedestal 3, which is composed of a material of which the coefficient of thermal expansion is same to or almost equal to that of the material of the thin piece mold 2 and thicker than the thin piece mold 2, through a thin film 4. COPYRIGHT: (C)2007,JPO&INPIT